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AMD BC-250 Case ATX & LASER/CNC PANELS 1

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AMD BC-250 Case ATX & LASER/CNC PANELS

Remix of Sonic cầm viên ngọc hỗn mang trong Frontiers By Meca_ 3D 3D

By cyryllo

Downloads
110

Files 11 10.6 MB

  • left_side_v2.dxfDXF · 14.6 KB
  • right_side_v2.dxfDXF · 13.9 KB
  • top_side_v2.dxfDXF · 23.9 KB
  • Front_v2.stlSTL · 443.1 KB

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Description

Here is a modified version of the case designed for the AMD BC-250 motherboard (PlayStation 5 APU). The project has been thoroughly redesigned for people who want to build a solid, custom gaming console (e.g., running PikaOS) and have access to a laser cutter or a CNC router.

The main goal of the modification was to move from a fully 3D-printed design to a hybrid one – combining a printed frame with flat side and top panels. This provides much better rigidity and a professional, industrial look.

v2

  • Added front-to-back alignment

  • Added improved mounting for the BC250 system at the front. Improved support and mounting pins for the fan.

  • Reduced number of mounting holes on the panels.

  • Better-fitting connectors

  • add Logo Steam

  • update step file

Main changes compared to the original:

  • Adapted for CNC and Laser: The design was modified so that the top and side panels can be cut from flat sheets of material.

  • Easy access to components: Using removable panels allows for very quick and convenient access to the inside of the case. Thanks to this, potential maintenance, cable management, or component upgrades are much easier.

  • Shortened case: The overall length of the case was simply shortened.

  • Optimized cutouts: I modified the layout of the mounting and ventilation holes. On the front, there is a large honeycomb mesh area that ensures a massive flow of cool air, while additional slots help dissipate heat.

  • Logo placement: I added a dedicated, aesthetic spot on the front to place your own logo (e.g., Steam).

Cooling and Power Supply Guidelines: The BC-250 board can generate a lot of heat. The case is designed for a standard ATX power supply (I recommend a minimum of 600W with a native 8-pin connector to prevent voltage drops). There is plenty of room inside to hide unused cables. To ensure optimal temperatures under heavy load, the front is adapted for mounting very high-performance fans (even those up to 3000 RPM). Hot air from the processor is exhausted directly outside through a custom rear tunnel.

Assembly, Printing, and Materials Recommendations:

  • Frame joints: You will need M3x5 heat-set inserts to connect the frame elements.

  • Panel mounting: The cut panels should be screwed to the frame using M3x12 screws for plastics.

  • Cut panels: The design assumes using 4 mm thick sheets. For a prototype, ABS cut on a CNC machine works great; for the final version, I recommend aluminum.

  • Printed parts: The outer frame elements can be printed from standard materials (e.g., PETG, ABS, ASA).

  • Exhaust tunnel: Due to direct contact with the hot APU heatsink, I highly recommend printing the internal exhaust tunnel from high-temperature resistant materials like HT PLA (which can withstand up to 150°C), ABS, or PC. This will prevent any deformation.

Happy printing and good luck with the build! If you have any questions about the assembly, leave a comment.

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Print spec

Formats
3mfdxfstepstl
Model files
11
Total size
10.6 MB
Largest file
8 MB

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